ESD Protection Cont'd

Packaging/Handling:

1) Suitable packaging:

  • Antistatic tubes, bins, conductive foams

  • Plastics with conductive material 

  • Place PCB in static-shielding bag before/after use

    • Avoid using torn or punctured static-shielding bags

2) Cover unused connectors with antistatic materials when not in use 
3) Clothing/Area:

4) Things to avoid during handling:

  • Tools with plastic handles, since handle can get charged due to triboelectric effect 

  • Letting boards/components come in contact with clothing, since static charges on fabrics can’t be dissipated with normal grounding

  • Moving PCBs unnecessarily 

  • Coming into contact with the connectors and components 

  • Letting chargeable plastics, like binders, within 0.6m of unshielded PCBs

  • Letting PCBs come within 0.3m of a computer monitor

5) Use a soldering iron with a tip that has proper ground connection:

  • Prevents chance of potential differences between pins of the device during handling

6) Humid atmosphere:

  • Discharges atmospheric floating charges to ground 

  • Provides protection against static electricity build up due to dry air

  • Maintain a relative humidity level between 20% and 80% non-condensing 

PCB Design: 

1) Clean and low impedance ground:

  • Allows electrostatic discharge currents to flow to ground easily 

  • Create a clean ground using a mixture of analog and digital circuits 

  • Unused areas in PCB should be converted to a ground plane 

2) Avoiding long leads and PCB traces: 

  • Have parasitic inductance 

  • Cause voltage overshoots and ringing issues if an ESD transient gets into the circuit

3) Reduce loop areas:

  • If board routing encloses large loop areas -> conducting paths enclose more magnetic flux -> loop currents cause interfering fields -> affects circuit components 

  • Route supply and ground lines close together

  • Signal lines should have ground lines running close by 

4) Trace all around PCB edge: 

  • Acts as a guard trace to be connected to ground

  • Discharges static due to human contact

  • Ensure large spacing between adjacent traces on the board

5) EMI Suppression Filters:

6) Transient-suppressor diodes:

  • These are connected at critical points in the circuit, between input and output pins to ground

  • Kept close to terminals

  • Clamp voltage to a safe value based on the rating  

  • To suppress ESD transients, place a ferrite bead on the input lead and connect a low value capacitor from the input lead to ground. LC at input filters the energy in the ESD transient to ground.

 

References

https://www.murata.com/en-us/products/emc

https://www.eetimes.com/design-techniques-to-control-electrostatic-discharge-damage-in-electronic-devices/#

https://docs.novatel.com/OEM7/Content/Appendix/ESD_Practices.htm?TocPath=Maintenance%7C_____8