MS16 Cell Level Fusing
Approach | Pros | Cons |
---|---|---|
Plate |
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Wires |
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Fusing currents for various wire dimensions: https://www.powerstream.com/wire-fusing-currents.htm
Plate design video to serve as a basis: Making Battery Strips W/ Cell Level Fusing
Thermal conductivity for various metals for plating/wires: https://www.engineeringtoolbox.com/thermal-conductivity-metals-d_858.html
Testing procedure:
Plate approach
Electrical performance (to ensure fuse plate allows desired current to flow)
measure resistance across multiple points on the plate (check uniform distribution)
apply increasing current to simulate overcurrent conditions to determine the actual blow current and compare to the design value
Thermal behaviour (check how well it dissipates heat)
run a continuous discharge cycle and record temperature at different points on the plate
or use simulations to model the heat dissipation
Stress tests (checking it can withstand vibrations)
Failure tests
force a single cell failure (overcharge, external short, thermal runaway)
if blown fuse disconnects, verify adjacent cells status, (did they experience any electrical or thermal stress as a result of the blown fuse)
check how a blown fuse affects the overall module and by what percent the performance is lowered by
Wire appraoch
Electrical performance
measure wire resistence to ensure uniformity across cells
slowly increase current to record at what point the wires melt
consistently check if some wires heat up more than others (checking for uneven conditions)
Thermal behaviour
measure temperature in high-current conditions
check for hotspots in design if possible
test different wire materials to compare heat dissipation (research for wire materials to be written below)
Thermal conductivity: Cu (ETP) = ~390 > Al = ~237 > Ni = ~90
Sigmaclad: ranges from 52 to 317 depending on which version we have
https://www.emsclad.com/wp-content/uploads/sites/12/2023/02/SIGMACLAD-Datasheet.pdf
Note: not sure how much heat dissipation matters in individual wires actually matter
Durability (strength tests)
perform vibration testing or use simulation to see if the expected force is enough to break the connections
Failure tests
force a single cell failure (overcharge, external short, thermal runaway)
if blown fuse disconnects, verify adjacent cells status, (did they experience any electrical or thermal stress as a result of the blown fuse)
observe any unintended side effects ie thermal damage to nearby components or sparking
check how a blown fuse affects the overall module and by what percent the performance is lowered by
Hypothesis prior to testing
Test | Plate | Wire |
---|---|---|
Design | Harder and time consuming | Easier and more flexible |
Implementation | Easier | More time consuming |
Electrical uniformity | more consistent across cells | variability in individual wires |
thermal dissipation | spreads heat more evenly | potential for localized hotspots |
repairs | hard to replace individual fuses | easier |
vibration resistance | more robust | wires can loosen over time |
failure isolation | works if designed properly | works if wire melts fully |
cost | probably more expensive | probably cheaper |