Topics:

• Goals for Winter 2017
• High Level System Overview with Diagram
• Standardize components (incl. connectors)
  
  

Goals for Winter 2017

• Finalize controller board.
• Finish precharge/discharge.
• Finish HAL/x86 emulation layer.
• DCDC converter board. 
• CAN Motor controller translator board.
• Design and have in rev both driver control boards (Themis/Lights).
  • Consider merging to one board.
    
    • No, due to MCU FSM things.
• Design and finish the power distribution board (Chaos).
• Battery pack 
  • Find vendor and manufacturer
  • Start cell test and building modules
• Telemetry/BMS (Alexa/Kevin/Karl)
• Array
  • Research cells.
  • Have distributor/encapsulation selected.

System Overview

Standardize Components/Footprints

Effort will be made to conform to these standardized footprints and components whenever possible to reduce inventory. 

Resistors: 0603 (up to 1/4W), and 1206 (up to 1W)

Capacitors: 0603 and 1206 

MOSFETS: Decide on 1 P-Channel and 1 N-Channel MOSFET for pretty much all boards. Footprints should be different to eliminate the possibility of using the wrong component. 

Board to Wire Connectors: Molex Clik-Mate 1.0mm, 1.5mm, 2mm pitch connectors. 

Wire to Panel: 

Wire to Wire: 

HV Wire to Wire: Anderson Power Pole SB120?