Hardware Style Guide

Schematic Capture

Align all electrical connections (net label to wire, wire to pin, wire to port, etc) to a 10mil snap grid (Basic Concepts - Grids).
Set all net labels, power and GND rails, ports, harnesses to size 10 font.
Set Midsun_Schematic_Template_Letter.SchDot as the default template for schematics
- Go to DXP>Preferences>System>New Document Defaults
- Under PCB Project>Schematic, choose the SchDot file from the Github Hardware Repo (..\Hardware\MSXII_Project_Template\Midsun_Schematic_Template_Letter.SchDot)

All boards must include title block with board name, Rev X.Y (see below), designer(s), and date the board was sent to fab
All boards must have 4 mounting holes of size M2.5
Teardrops should be added at the end of layout

Do NOT match IC pinouts to their physical layout. Instead, put power pins on top, ground on the bottom, inputs on the left and outputs on the right. See here for reasoning.
Align all pins to a 10mil snap grid (Basic Concepts - Grids).
Use pin length of 20mil.
Add Component Parameters using the Supplier Search feature (Libraries and Component Creation - Using Supplier Search to add Component Parameters in Bulk)
Set important parameters to visible so they can be viewed in the schematic:
- Capacitors (Capacitance, Voltage, Temperature Coefficient)
- Resistors (Resistance, Power, Tolerance)
- Inductors (Inductance)
- Connectors (Pitch)
- Crystals (Frequency)
- Diodes (Voltage, Current (for Schottky Diodes), Power (For TVS Diodes))
- LEDs (Forward Voltage, Colour)
- Complex ICs (Manufacturer Part Number)
- Other (Relevant maximum ratings as necessary)

Pin 1 on all SMT footprints will have rectangular pads with rounded rectangular pads on all other pins.
Pin 1 on all through-hole footprints will have square pads, all other pins will have circular pads.
Pin 1 of all footprints will be clearly defined on silkscreen
All wire-to-board connectors must have clearly visible pinouts on silkscreen
All components will have a 3D model. The more accurate the better, but at a minimum must provide the maximum bounds on the part.

Wire-to-board signals will use 2.0mm pitch Duraclik connectors (DuraClik Connector System).
Wire-to-board power will use 3.5mm pitch Ultra-Fit connectors (Ultra-Fit Connector System).
Panelmount connectors will use a sealed, locking connector.
HV power will use Anderson SB120s.

All carrier boards will supply 12V to controller boards through the Bergstak mezzanine connector.

Hardware revisions will be denoted by Rev X.Y
- X refers to the major revisions, each time a new version of the board is fabricated, X will be incremented by 1, Y will be set to 0
- Y refers to minor revisions prior to fabrication, each commit related to the project will increment Y by 1
  - All boards must be reviewed by the electrical leads prior to fabrication
All revisions should be properly documented on Confluence under the appropriate project page