Hardware Style Guide

Schematic Capture

All boards must include title block with board name, Rev X.Y (see below), designer(s), and date the board was sent to fab
All boards must have 4 mounting holes of [size TBD]

Do NOT match IC pinouts to their physical layout. Instead, put power pins on top, ground on the bottom, inputs on the left and outputs on the right. See here for reasoning.
Component Parameters:
- Supplier
- Supplier_PN
- Manufacturer
- Manufacturer_PN
- Resistance/Capacitance/Inductance (For resistors, capacitors, or inductors)
- Forward Voltages (For diodes)
- Tolerances for passives
- Ratings for capacitors (X7R, X5R etc.)
- Relevant maximum ratings (for connectors, saturation current in inductors etc.)

Pin 1 on all SMT footprints will have rectangular pads with rounded rectangular pads on all other pins.
Pin 1 on all through-hole footprints will have square pads, all other pins will have circular pads.
Pin 1 of all footprints will be clearly defined on silkscreen
All wire-to-board connectors must have clearly visible pinouts on silkscreen
All components will have a 3D model. The more accurate the better, but at a minimum must provide the maximum bounds on the part.

Wire-to-board signals will use 2.0mm Duraclik connectors (DuraClik Connector System).
Wire-to-board power will use another connector capable of 10A.
Panelmount connectors will use a sealed, locking connector.
HV power will use Anderson SB120s.

Hardware revisions will be denoted by Rev X.Y
- X refers to the major revisions, so every time a new version of the board is fabricated, the revision is now Rev X.0
- Y refers to minor revisions prior to fabrication, so each time things are changed after a review
  - All boards must be reviewed by the electrical leads prior to fabrication
All revisions should be properly documented on Confluence under the appropriate project page