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Great forum thread on EEVBlog: https://www.eevblog.com/forum/reviews/qs-5100-reflow-oven-any-tips-warings-etc/

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View file
nameQinsi_QS-5100_IR_REFLOW_OVEN.pdf

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QS-5100 Details

  • Features

    • One sided infrared heating

  • Issues

    • Uneven temperature distribution causing uneven heating and inconsistent solder joint across a board

    • Not CSA certified

Where is the sensor that the oven uses to measure the temp? - it would be great to know to compare accuracy of the results.
It is worth noting that the temperature displayed on the oven is different from the temperature measured on the PCB by a lot - up to 30 C, even in lower temperatures.

General Reflow Tips

  • Preheat the board to bring the board up to temp to reduce the chance of cold solder joints if the whole joint is not up to temp. This is done in the preheat section of the reflow profile

  • Don't make the preheat period too long or else all of the flux will dry out

  • Every component usually has a recommended reflow profile in the datasheet (or at least max temps), as well as the solder paste

    • We will follow the recommendation for the solder paste, as this

  • Three power levels can be set (preheat, heat, and solder) the user can change the temperature of each level and set how long the temperature will be held forĀ 

    • Note that this time does not include the time to get up to said temperature

Setting

Fill this out with the definitions for the various heating times for the Qinsi QS-5100
I do not believe that the rate of heat rise of cooling is controllable from the settings, just the time that it stays at the set temperature.

  • Heat

  • Solder

  • etc.

Recommended Heating Profile

The following figure is from the CHIPQUIK TS391AX50 data sheet. It outlines the recommended profile for the solder paste.Image Removed

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Tips

  • Don't place items directly on the metal rack, raise them with pieces of unused PCBs (from the EEVBlog post)

  • etc.

Testing

We want to make sure that our reflow oven is actually reaching the desired temperatures during the profile. We have purchased a high temperature type K thermocouple that we can place inside the oven to measure the temperature of the boards in real time. We will make sure that this profile lines up with the settings that we selected.

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The following figure shows the temperature of the corner of another copy of the same PCB. The same pattern as above can be observed, but the temperature is notably higher than what was measured in the center of the board.Image Removed

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The following image shows the heat distribution of a PCB after reaching peak temperature. It is difficult to see the temperature across the board, possibly because of the high difference between the temperature of the board and the temperature of the surroundings. The angle of the camera also greatly affects the temperature readings so the hot spots on the left are likely not actually there, and the actual temperature of the board is much more accurately determined from the thermocouple plots above.Image Removed

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Profiles

Leaded Solder Paste

Current Profile:

Preheat: 150C 30s

Heat: 175C 20s

Solder 210C 3s

Keep: 205C

Cool: 70C

Expand
titleProfiles that did not work

Preheat: 130C 30s

Heat: 183C 20s

Solder 220C 5s

Keep: 180C

Cool: 100C

This resulted in burnt and deformed Molex ultrafit connectors. The 60-pin mezzanine was fine.