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- Preheat the board to bring the board up to temp to reduce the chance of cold solder joints if the whole joint is not up to temp. This is done in the preheat section of the reflow profile
- Don't make the preheat period too long or else all of the flux will dry out
- Every component usually has a recommended reflow profile in the datasheet (or at least max temps), as well as the solder paste
- We will follow the recommendation for the solder paste, as this
- etc.
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