Skip to end of metadata
Go to start of metadata

You are viewing an old version of this page. View the current version.

Compare with Current View Page History

« Previous Version 19 Next »

AFE

Revision 1  

Retrospective

  • Needs power LED so we can tell if the board is powered
  • Through-holes need to be widened
  • Test points should be through-hole (SMT pads are too sketchy for HV)
  • Use smaller analog mux?
  • Turns out the LTC6804 requires Vtop and Vbottom to be connected?
  • T_SELx need to have pullup resistors to Vreg (they're open-drain) - see pg60 in the LTC6804 datasheet
  • Change to vertical 2 pin duraclik headers 

Revision 2

Retrospective

  • Through-holes still need to be widened
  • The C6 inputs on both connectors should be fused or one should be removed - I recommend removing one and switching to a 6-pin duraclik to prevent plugging in harnesses the wrong way
  • Still need to use smaller analog mux
  • ICMP and IBIAS pins are flipped - Should be IBIAS → resistor → ICMP → resistor → GND
  • Silkscreen for connectors, silkscreen for daisy-chain direction
  • Use Vref2 for the external thermistor? It's at 3V nominal and seems to be designed for thermistors.
  • Replace the 10k resistors for thermistors with a resistor array?
  • Remove outdated note in isoSPI Interface sheet
  • Missing 100ohm and capacitor on C0?

Carrier

Revision 1  

Retrospective

  • MISO and MOSI need pull up resistors to 3v3, they are also open-drain outputs 
  • The 2 pin header for ISO SPI has pins 1 and 2 reversed, they should be swapped. 

Revision 2

Retrospective

  • isoSPI Mode 0 by default (for current sense)
  • Add connector for kill switch
  • Add ability to switch between master/slave and modes on isoSPI so we can use it as a sniffer
  • Bias resistors are flipped and are odd values - should be the same as AFE
  • Needs test points for 3v3, 12v, and GND
  • No labels