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A critical step in designing any piece of hardware and a large part of this guide is schematic capture. This process fleshes out all the high level decisions made during for the system architectingarchitecture, connections between all components, as well as and symbolic representations of each component. The schematic is crucial for anyone debugging and working with a system at a hardware or firmware level, so readability and logical organization must be kept in mind during the schematic capture process.

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• Align all electrical connections (net label to wire, wire to pin, wire to port, etc) to a 10mil snap grid (Basic Concepts - Grids).
• All net labels, power and GND rails, ports, harnesses must be size 10 font.
• Set Midsun_Schematic_Template_Letter.SchDot as the default template for schematic sheets (Schematic Parameters - Document Parameters)
• Ensure that you update revisions both in the schematic (Documet Document Parameters) and on the PCB (Silkscreen) every time you commit to your branch. 

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Specific guidelines to follow:

• For complex ICs, do NOT match IC pinouts to their physical layout. Instead, put power pins on top, ground on the bottom, inputs on the left and outputs on the right. See here for reasoning.

• Component naming (symbol reference) will follow this convention:

  Code Block
  language bash firstline 1
  [TYPE OF COMPONENT] [DESCRIPTIONS AND FEATURES] [PACKAGE (where applicable)]

  Common types of components:

  Code Block
  language bash firstline 1
  IC, CAP, RES, EVAL, CONN, LED, IND, MOSFET, POT, DIODE, CRYSTAL, XFMR

  Sample Descriptions:

  Code Block
  language bash firstline 1
  REG BUCK 5V 0.3A, OPTOISOLATOR 5KV, ADC 24BIT

  Sample Packages:

  Code Block
  language bash firstline 1
  10DFN, SOT23-5, 0603, 8-SOIC, 5-SSOP

  Complete Example:

  Code Block
  language bash firstline 1
  IC REG BUCK 5V 0.3A 8-TDFN

  
  

• Add Component Parameters using the Supplier Search feature (Libraries and Component Creation - Using Supplier Search to add Component Parameters in Bulk)
• Set important parameters to visible so they can be viewed in the schematic:
  • Capacitors (Capacitance, Voltage, Temperature Coefficient)
  • Resistors (Resistance, Power, Tolerance)
  • Inductors (Inductance)
  • Connectors (Pitch)
  • Crystals (Frequency)
  • Diodes (Voltage, Current (for Schottky Diodes), Power (For TVS Diodes))
  • LEDs (Forward Voltage, Colour)
  • Complex ICs (Manufacturer Part Number)
  • Other (Relevant maximum ratings as necessary)
• Align all pins to a 10mil snap grid (Basic Concepts - Grids).
• Use pin length of 20mil.

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• Pin 1 on all SMT footprints will have rectangular pads with rounded rectangular pads on all other pins, the . The only exemption exception is for QFN pads or other pads with small clearances. Manufacture Manufacturer suggested layout patterns should be followed. .
• Pin 1 on all through-hole footprints will have square pads, all . All other pins will have circular pads.
• Pin 1 of all footprints will be clearly defined on silkscreen
• All wire-to-board connectors must have clearly visible pinouts on silkscreen
• All components will have a 3D model. The more accurate the better, but at a minimum must provide the maximum bounds on the part.

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