Schematic Capture
- All Align all electrical connections (net label to wire, wire to pin, wire to port, etc) must be aligned to a 10mil snap grid.
- Set Midsun_Schematic_Template_Letter.SchDot as the new documents default for schematics
- Go to DXP>Preferences>System>New Document Defaults
- Under PCB Project>Schematic, choose the SchDot file from the Github Hardware Repo (..\Hardware\MSXII_Project_Template\Midsun_Schematic_Template_Letter.SchDot)
PCB Layout
- All boards must include title block with board name, Rev X.Y (see below), designer(s), and date the board was sent to fab
- All boards must have 4 mounting holes of [size TBD]of size M2.5
- Teardrops should be added at the end of layout
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- Do NOT match IC pinouts to their physical layout. Instead, put power pins on top, ground on the bottom, inputs on the left and outputs on the right. See here for reasoning.
- All Align all pins must be aligned to a 10mil snap grid.
- Add Component Parameters :
- Supplier
- Supplier_PN
- Manufacturer
- Manufacturer_PN
- Resistance/Capacitance/Inductance (For resistors, capacitors, or inductors)
- Forward Voltages (For diodes)
- Tolerances for passives
- Ratings for capacitors (X7R, X5R etc.) Relevant maximum ratings (for connectors, saturation current in inductors etc.using the Supplier Search feature (Libraries and Component Creation - Using Supplier Search to add Component Parameters in Bulk)
- Set important parameters to visible so they can be viewed in the schematic:
- Capacitors (Capacitance, Voltage, Temperature Coefficient)
- Resistors (Resistance, Power, Tolerance)
- Inductors (Inductance)
- Connectors (Pitch)
- Crystals (Frequency)
- Diodes (Voltage, Current (for Schottky Diodes), Power (For TVS Diodes))
- LEDs (Forward Voltage, Colour)
- Complex ICs (Manufacturer Part Number)
- Other (Relevant maximum ratings as necessary)
PCB Footprint
- Pin 1 on all SMT footprints will have rectangular pads with rounded rectangular pads on all other pins.
- Pin 1 on all through-hole footprints will have square pads, all other pins will have circular pads.
- Pin 1 of all footprints will be clearly defined on silkscreen
- All wire-to-board connectors must have clearly visible pinouts on silkscreen
- All components will have a 3D model. The more accurate the better, but at a minimum must provide the maximum bounds on the part.
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- Wire-to-board signals will use 2.0mm pitch Duraclik connectors (DuraClik Connector System).
- Wire-to-board power will use another connector capable of 10A3.5mm pitch Ultra-Fit connectors (Ultra-Fit Connector System).
- Panelmount connectors will use a sealed, locking connector.
- HV power will use Anderson SB120s.
Carrier Board Standards
- All carrier boards will power supply 12V to controller boards through the Bergstak mezzanine
Mechanical Standards
- All mounting holes
- connector.
Hardware Revisions
- Hardware revisions will be denoted by Rev X.Y
- X refers to the major revisions, so every each time a new version of the board is fabricated, the revision is now Rev X.X will be incremented by 1, Y will be set to 0
- Y refers to minor revisions prior to fabrication, so each time things are changed after a revieweach commit related to the project will increment Y by 1
- All boards must be reviewed by the electrical leads prior to fabrication
- All revisions should be properly documented on Confluence under the appropriate project page
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