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Post-Assembly Design Test:

Before we start testing the PCB under high voltage conditions, it is important to first check the board over while it is disconnected from power or any load. To do so, check all connections for proper solder joints, make sure diodes are oriented correctly, and nothing is shorting. Resistance and continuity checks with a multimeter will be useful for this. Additionally, the boards will be inspected against the 3D viewer on Altium to catch any immediate issues.

Quick Design Test:

As a minimum, the following tests are strongly recommended once the PCB is assembled:

1. Maximum Drain Voltage – Verify that VDS of InnoSwitch4-CZ does not exceed the maximum continuous drain voltage and SR FET do not exceed 90% of breakdown voltages at the highest input voltage and peak (overload) output power in normal operation and during start-up.

2. Maximum Drain Current – At maximum ambient temperature, maximum input voltage and peak output (overload) power. Review drain current waveforms for any signs of transformer saturation or excessive leading-edge current spikes at start-up. Repeat tests under steady-state conditions and verify that the leading edge current spike is below ILIMIT(MIN) at the end of tLEB(MIN). Under all conditions, the maximum drain current for the primary switch should be below the specified absolute maximum ratings.

3. Thermal Check – At specified maximum output power, minimum input voltage and maximum ambient temperature, verify that temperature specification limits for InnoSwitch4-CZ IC, transformer, output SR FET, and output capacitors are not exceeded. Enough thermal margin should be allowed for part-to-part variation of the RDS(ON) of the InnoSwitch4-CZ IC. Under low-line, maximum power, a maximum InnoSwitch4-CZ SOURCE pin temperature of 110 °C is recommended to allow for these variations.

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https://www.youtube.com/watch?v=WQXABq45VIg&ab_channel=RobertBolanos

Tools:

• HV supp/Oscilloscopesupply

• Load Tester

• Oscilloscope

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