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Pins shall be of the “passive” type. It’s too much of a hassle to deal with maintaining the proper logic required for other pin types across all our schematics.
Pin length shall be 200 mils.
Parameters
Symbols shall have the following visible parameters:
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The standard thermistor has a 10k value and is situated on the low side.
PCB
Mounting
Hole Type
The M2.5 hex standoff component shall be used to for PCB mounting homes. The hole shall be 2.7mm in diameter, with a keep-out area 6mm in diameter. Mounting holes shall be low voltage ground where applicable.
Placement
Holes are placed in corners with the centre 3.5mm from the edge.
Size
Boards to be mounted on top of battery modules shall be 70 x 100mm with mounting holes located 3.5mm from adjacent edges in each corner.
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Standard signals shall use 50ohm traces with an impedance profile set in Altium. Use Saturn Toolkit to calculate required width for higher current applications.
Via Size
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Vias
Standard Size [pad/hole] (mm)
2 Layer: 0.5/0.3
Multilayer: 0.3mm pad45/hole0.2
For higher current applications, typically multiple standard size vias offer greater layout flexibility than one very large via. Controlled impedance signals shall have controlled impedance vias. Saturn toolkit can be used to calculate via impedance and current carrying capacity. Standard JLC plating thickness is 18um, and the expected temperature rise shall be no more than 25C.
Stitching Vias
Test Points
Size
SMD test points shall have an exposed copper area of at least a square with edge length of 1.27mm.
Through hole test points shall be un-tented PTH with a 0.7mm hole and at least a 1mm pad diameter.
SMD test points are required for power rails and any analog voltages being measured by an ADC. Both SMD test points and 2.54mm headers are required for digital communication busses.
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The top layer silkscreen shall contain the following graphic, with text under the “Midnight” letters in the following format:
[Car#] [BRD Name] Rev [Majormajor.minor]
ie. MSXV Controller Board Rev 1.0
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Small SMD components shall be spaced at least 0.5mm apart, or such that their outermost silkscreen lines do not more than fully overlap, whichever is greater.
Solder Paste Stencils
Stencil openings shall