...
The M2.5 hex standoff component shall be used to PCB mounting homes. The hole shall be 2.7mm in diameter, with a keep-out area 6mm in diameter.
Size
Boards to be mounted on top of battery modules shall be 70 x 100mm with mounting holes located 3.5mm from adjacent edges in each corner.
Trace Width
Standard signals shall use 50ohm traces with an impedance profile set in Altium. Use Saturn Toolkit to calculate required width for higher current applications.
...
Standard vias are generally 0.5/0.3mm pad/hole. For higher current applications, typically multiple standard size vias offer greater layout flexibility than one very large via. Controlled impedance signals shall have controlled impedance vias. Saturn toolkit can be used to calculate via impedance and current carrying capacity. Standard JLC plating thickness is 18um, and the expected temperature rise shall be no more than 25C.
Test Points
Size
SMD test points shall have an exposed copper area of at least a square with edge length of 1.27mm.
...