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Harnessing
Connectors
Type
Molex 3mm Microfit
Pinout
Pinouts on schematics will be one-one. If net x connects from board 1 to board 2, pin 1 for the connector on board 1 should correspond to pin 1 for the connector on board 2.
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Note that some resistors claim very high power ratings. These are often under certain conditions where case temperature is kept to 25C through external heat sinking. This is not realistic for us, since keeping a part at room temperature while under full load requires sub ambient cooling. Thus, appropriate derating is required along with external heat sinking for high power applications.
Capacitors
Type
MLCCs are preferred for most applications due to their low ESR and high capacitance per volume. Film or electrolytic capacitors may be used in high voltage or high capacity applications.
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The rated current shall be at least double the expected application. The maximum current is typically defined by the thermal limit of how much heat the part can handle due to IR losses. Note that especially for high current FETs, the max current is given for specific conditions, often at a case (surface) temperature (Tc) of 25C. In reality, it is not realistic to keep the surface of the part at 25C under full load, as this would require sub ambient cooling. Thus, appropriate component derating must be performed.
PCB
Mounting
M2.5
Trace Width
Saturn toolkit