These are some things that I realized as I was going through the CAD tonight. Taking screenshots and documenting them here for Renzo Villanoy
Oct 9, 2020
Vertical Securing of Modules
There need to be wires going along the channels between the modules here, in the area in green, so that area must be hollow, and the original design would require shoving wires out of the way and trying to find the threaded insert location at the bottom of the enclosure.
The orange part would be 3D printed, and epoxied to the bottom of the enclosure. The green area is a slot in the printed part for wires to pass through. The yellow piece is a heat-set insert installed from the bottom, putting the soldering iron in the area where the slot is. Being installed from the bottom gives better pull-out resistance for axial loads. The orange part should be printed such that the cross-section shown is 1 layer, in order to avoid layer delamination along the thin sections at the sides.
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Also - these connectors are an issue (circled in blue)
Maybe we would want to bend the plastic down, and out as shown in the orange line? This orientation also gives us better access to the rest of the electronics.
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Sept 26, 2020
Make this distance larger (to around 5cm) - there is an end piece on the row of modules not in CAD yet.
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